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The applied hydrostatic pressure enhanced the critical cross sectional area and reduced the cracks and chippings of all the tested materials. Effects of hydrostatic pressure on the machining characteristics of the crystalline and glassy materials are discussed in detail.
Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting ...
Precision machining of germanium and silicon was studied using single‐point diamond turning. Special attention was directed to the so‐called ductile regime wherein optical quality surface finishes can be machined directly on brittle materials.
Ductile regime grinding of ferrite with variation of grain size by a piezoelectric-driven micropositioning grinding table J-D Kim and S-R Nam Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Taejon, Korea Abstract: A mirror-like grinding of brittle materials is required in many precision ...
diamond turning of brittle materials like Silicon Nitride (Si3N4) have been reported as an alternative to finishing processes such as grinding and polishing [2,3]. Ductile machining of brittle materials, where material removal is by plastic deformation is possible at very low material removal rates, usually in the micrometer range [7,8].
only when chip removal is done at the atomic level. Recent developments of ductile mode machining of hard and brittle materials show that plastically deformed chip removal minimizes the subsurface damage of the workpiece. When chip deforma-tion takes place in the ductile regime, a .
Supplement Vo!. 12 No.2, 2004 Precision Grinding of Hard and Brittle Materials Fig. 2: High speed jig grinding of silicon and glass Two grinding wheel bond types, metal and resinoid, each with three different grit sizes, 10-30 mm, 40-60 mm and 50-70 mm were used in generating aspheric surfaces using the grinding zone method.
Dec 16, 2014· Ductile regime grinding is an effective machining process that has been used for brittle materials for several years now. In ductile regime grinding, material is removed through plastic deformation, which reduces the risk of fractures and compromised materials. Regime grinding also eliminates or minimizes the need for polishing and lapping ...
Apr 12, 2018· Ductile materials are those which can be drawn into wires when tension is applied, And can be drawn into sheet when compressive load is applied For the above mentioned properties the material should have a tendency to elongate i.e for lower value...
Ductile-Regime Turning of Brittle Materials by Single Point Diamond Ichiro Ogura, Yuichi Okazaki ... Blake and Scattergood investigated the critical depth of cut for single crystals of germanium ... T. Bifano, T. Dow, and R. Scattergood: Ductile Regime Grinding: A New Technology for Machining Brittle Materials. ASME, J. Eng. Ind., 113, 5 (1991 ...
and on ductile-regime machining of brittle materials. When a material was ma- chined in such a fine scale that satisfied ductile-regime conditions, then the chip was removed in a ductile manner despite the brittle nature of the material. A model for the critical depth associated with ductile-regime in micromachining was proposed (6):
This process is known as ductile-regime grinding. When brittle materials are ground through a process of plastic deformation, surface finishes similar to those achieved in polishing or lapping are produced. Unlike polishing or lapping, however, grinding is a deterministic process, permitting finely controlled contour accuracy and complex shapes.
In ultraprecision grinding of brittle materials, the transition from ductile-regime grinding to brittle-regime grinding that results from an increasing grinding grain depth of cut is accompanied by a reduction in the specific grinding energy. Furthermore, as the grain depth of cut is increased beyond the transition point into purely
grinding ductile or brittle materials. In a brittle material, the "chips" are just smaller. The removal mecha-nism for a brittle material is achieved through micro-fracture and the sub-sequent removal of the chips by the next passing grain (see Figure 1).
[3] Z.W.Zhong in his paper on ductile or partial ductile mode machining of brittle materials discussed the machining mode for silicon, glass, and some advanced ceramics. Scanned electron ...
This paper proposes machining under high hydrostatic pressure as a new damage-free machining method for hard-brittle materials. Experiments for this study utilized a specially designed scratching test device, and the pin-on-disc scratching tests were conducted with three (3) hard-brittle materials (i.e., silicon, glass, and quartz) under pressure of 400 MPa and zero MPa.
Similarities and differences between ductile material and brittle material are provided in this article. At a particular temperature, a ductile material exhibits substantial plastic deformation under external loading, while a brittle material breaks with negligible plastic deformation under tensile stress.
Ductile-regime grinding is a new technology made possible by the use of real-time control and precision engineering in the grinding process. By ensuring that the abrasive grinding forces do not exceed a threshold value, it is possible to grind materials that are normally considered "brittle" in such a way that the material removal takes place through plastic deformation rather than fracture.
Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming.
This process is known as ductile-regime grinding. When brittle materials are ground through a process of plastic deformation, surface finishes similar to those achieved in polishing or lapping are produced. Unlike polishing or lapping, however, grinding is a deterministic process, permitting finely controlled contour accuracy and complex shapes.
Aug 07, 2013· The normal stress distribution profile associated with grinding a ductile material does not apply to grinding a brittle material like an advanced ceramic. Any induced tensile stress, which is usually caused by restricted thermal expansion at high temperatures, has already resulted in micro-cracking beneath the surface, as in a brittle material ...
PREDICTIVE MODELING FOR DUCTILE MACHINING OF BRITTLE MATERIALS A Dissertation Presented to The Academic Faculty By Sivaramakrishnan Venkatachalam In Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy in the George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology December, 2007
2 Grinding of brittle materials Many advanced materials such as ceramics, silicon and optical glass are hard and brittle materials. Since 1980s, ductile regime grinding of brittle materials has been and is continuing to be an intensive research area because of its .
Mar 29, 2006· Diamond turning, precision grinding, ductile regime machining, surface integrity. Ductile Machining of Brittle Materials. Hard and brittle materials such as glasses and ceramics are amongst the most difficult to machine.
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